Chip Tech|Huawei pushes semiconductor packaging innovation to ease US chip sanctions
Chip Tech|Huawei pushes semiconductor packaging innovation to ease US chip sanctions

Hi, everyone welcome to heartbeat space. Now you are on the journey to feel every real heartbeat of the world and we hope it will touch your heart and stimulate your thought. We all know that the semiconductor industry is a highly capital intensive and technology intensive industry. If you want to stand out in the semiconductor field, you need to have a good accumulation of original resources. Only in this way can you hope to quickly form a scale effect in the industry.

However, china has obvious deficiencies in this field. Years of technological backwardness have caused the entire industrial chain to lag behind europe and the united states. It is precisely because of this that huawei will stop the production plan of high silicon chips after the us adjusts the chip rules. After all, after tsmc was unable to ship freely, it was equivalent to cutting off the production. Channel of huawei has silicon chips, but huawei.

Never gave up its plan to develop its own chips. Although the production of hisilicon chips has stopped, the entire r d team still retains them. Fortunately, the hard work pays off. Huawei seems to have found a solution to bypass the euv lithography machine to produce high-performance chips. From the 2021 annual report released by huawei in march, we can understand huawei’s next development direction.

So what are huawei’s new measures? What is huawei’s new patent from my knowledge? Huawei may adopt a multi-core structure in the future, exchanging stacking, an area for chip performance now huawei has disclosed a patent 4, a chip, stacking package and terminal equipment which was applied for in september 2019, which can solve the problem of high cost caused by the use Of through silicon via technology, while ensuring the power supply demand, the innovation comes days after rotating chairman guaping suggested. Huawei would use advanced chip packaging technology to help ease us restrictions as a high-density packaging technology through silicon via technology can make transistors more integrated and bring stronger performance, but the disadvantage of a more difficult process is that an euv lithography machine is required. The price of euv lithography machine is quite expensive, and the production efficiency is very low, which directly leads to the high cost of chip manufacturing.

In addition, only asml can provide euv lithography machine, so huawei considers other solutions to avoid euv light. The problem of the engraving machine being stuck in the neck chinese telecom giant huawei technologies, co-limited, has filed a patent application in mainland china for an innovation in semiconductor packaging which industry analysts say is a potential way to mitigate the damage to the company’s business from u.s Chip sanctions, according to the official website of the state intellectual property office on april 5th, huawei disclosed a chip related patent. The patent titled a chip, stacking package and terminal equipment relates to the field of semiconductor technology, which can solve the problem of high cost caused by the use of through silicon via technology, while ensuring power supply requirements. At the recent huawei 2021 annual report conference huawei’s retaining chairman guaping said that, in the future, huawei may adopt a multi-core structure chip design scheme to improve chip performance.

At the same time, the use of area for performance and stacking for performance so that less advanced processes can continue to make huawei competitive in future products. It is worth mentioning that this is the first time huawei has publicly confirmed the chip stacking technology, that is to say higher performance, can be exchanged by increasing the area and stacking so as to achieve the competitiveness of low-tech processes to catch up with high performance chips. Privately held huawei, the world’s largest telecom equipment maker, and once china’s largest smartphone supplier was placed on washington’s trade blacklist in may 2019. The company has since scrambled to adjust its operations to accommodate tougher restrictions imposed in 2020, including accessing chips developed or produced using us technology. From anywhere according to a 2009 paper by the institute of electrical and electronics engineers, tsv technology enables stack chips to be interconnected by direct contact, providing high-speed signal processing and improved light detection for image sensing over the past decade, tsv’s have been introduced into high volume chip Manufacturing huawei’s latest effort echoes, are called by chinese industry experts to seek breakthroughs in chip assembly and packaging technology at the world semiconductor conference in the eastern city of nanjing last june on the sidelines of the event, jung lee ceo of changi and technology said that advanced Chip packaging, in which a group of integrated circuits are combined into a powerful semiconductor, will help expand.

Moore’S law first observed in 1965 by intel co-founder gordon moore moore’s law has become the rule of thumb for advances in computing power. It insists that the number of transistors on a chip doubles roughly every two years, while the total cost of computing power is halved. What are the main difficulties huawei faces in semiconductors? The main difficulty huawei faces in semiconductors is that it cannot manufacture advanced chips due to current equipment and foundry constraints, said wang minit, an expert in chip, packaging technology. One solution is to use larger nodes to produce chips, but at the cost of power consumption.

Wang minutes said: another solution is to assemble different types of chips that can be purchased in a sip system in package to make a complete final chip. This also sacrifices power consumption, but has the benefit of a shorter development cycle, lower final cost, etc. Advantage huawei’s consumer business, which includes smartphones, bears the brunt of u.s trade sanctions. Revenue for the business in 2021 fell 50 percent year over year to 243.

billion yuan 38.24 billion dollars. We need to rebuild our technical theory and architecture. Guaping said at a news conference last week we can use surface for performance, use stacking to improve performance and use less advanced processes and technologies to ensure huawei’s products remain competitive. This is the direction huawei is moving forward.

Meanwhile, huawei is beefing up its legion, a google-inspired organizational model to help boost revenue this year. What are huawei’s new legions later huawei announced the formation of 10 new legions, bringing its total number of expert teams to 15 The new army will focus on a variety of digital transformation products and services, with a shorter reporting line to huawei executives. There are 10 core assembled this time, namely electric power, digital core government affairs, one netcom core airport and rail, core, interactive media, core sports health, core display, new nuclear, core parkour, wide area network, core data center base core and legion of digital sites. From the name of the legion, you can also see the direction of huawei’s current key layout about half of the legion is related to digital and intelligent business, which is also the basic plan for huawei’s rapid development. At the same time, terminal related business has also been added to the army, such as sports health, wearable, smart screen and other businesses.

In short, in my opinion, the new solution designed by huawei is not friendly to some products with high performance requirements, but small device size. Small sized high performance chips still require euv lithography machines to produce chips such as wearable devices. The package on package solution may not be available, but there are not many such products after all, and even smartphones will be less and less affected, because the size of smartphones is getting bigger and bigger and they are developing in the direction of folding screens. So smartphones can also use this technology of stacked chips in this way. In the face of u.

sanctions and the blockade of euv lithography machines, the impact on huawei will continue to decrease and, with the concentrated rise of my country’s industrial chain, it is expected to develop domestic advanced lithography machines in the future will be restricted. Okay, we just spent another 10 minutes of deep thinking. Do you want to know what changes have taken place in the world in these 10 minutes? Please keep following our channel and like our videos,


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